Impact of probing procedure on flip chip reliability. - Kuo-Ming Chen; Kuo-Ning Chiang (Microelectron. Reliab., 2003)

Reconstruction and Fusion of Multi-modality Spinal Images. - Kuo-Ming Chen; Yuan-Tsung Chen; Ming-Shi Wang (CISST, 2004)

Thermal resistance analysis and validation of flip chip PBGA packages. - Kuo-Ming Chen; Kuo-Hsiung Houng; Kuo-Ning Chiang (Microelectron. Reliab., 2006)

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. - Kuo-Ming Chen; J. D. Wu; Kuo-Ning Chiang (Microelectron. Reliab., 2006)

A longest prefix first search tree for IP lookup. - Lih-Chyau Wuu; Tzong-Jye Liu; Kuo-Ming Chen (Comput. Networks, 2007)

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. - Yi-Shao Lai; Kuo-Ming Chen; Chin-Li Kao; Chiu-Wen Lee; Ying-Ta Chiu (Microelectron. Reliab., 2007)

Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology. - Hsien-Chie Cheng; Kun-Yu Hsieh; Kuo-Ming Chen (Microelectron. Reliab., 2011)

Energy-Efficient Deterministic Adaptive Beamforming Algorithms for Distributed Sensor/Relay Networks. - Chun-Wei Li; Kuo-Ming Chen; Po-Chun Fu; Wei-Ning Chen; Che Lin (CoRR, 2015)

Low-Complexity Beam Selection for Hybrid Precoded Multi-User mmWave Communications. - Kuo-Ming Chen; Yun-Han Pan; Ta-Sung Lee (ICSPCC, 2018)

Lifetime Maximization for Uplink Transmission in UAV-Enabled Wireless Networks. - Kuo-Ming Chen; Tsung-Hui Chang; Ta-Sung Lee (WCNC, 2019)

Machine Learning Based Automatic Diagnosis in Mobile Communication Networks. - Kuo-Ming Chen; Tsung-Hui Chang; Kai-Cheng Wang; Ta-Sung Lee (IEEE Trans. Veh. Technol., 2019)