Impact of probing procedure on flip chip reliability. - Kuo-Ming Chen; Kuo-Ning Chiang (Microelectron. Reliab., 2003)

Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. - Chia-Tai Kuo; Ming-Chuen Yip; Kuo-Ning Chiang (Microelectron. Reliab., 2004)

Thermal resistance analysis and validation of flip chip PBGA packages. - Kuo-Ming Chen; Kuo-Hsiung Houng; Kuo-Ning Chiang (Microelectron. Reliab., 2006)

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. - Kuo-Ming Chen; J. D. Wu; Kuo-Ning Chiang (Microelectron. Reliab., 2006)

Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. - Chih-Tang Peng; Chia-Tai Kuo; Kuo-Ning Chiang; Terry Ku; Kenny Chang (Microelectron. Reliab., 2006)

The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis. - Ming-Chih Yew; C. Y. Chou; C. S. Huang; W. K. Yang; Kuo-Ning Chiang (Microelectron. Reliab., 2006)

Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure. - C. C. Chiu; H. H. Chang; Chang-Chun Lee; C. C. Hsia; Kuo-Ning Chiang (Microelectron. Reliab., 2007)

Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. - Chang-Chun Lee; Chien-Chen Lee; Hsiao-Tung Ku; Shu-Ming Chang; Kuo-Ning Chiang (Microelectron. Reliab., 2007)

Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis. - Ming-Chih Yew; Chan-Yen Chou; Kuo-Ning Chiang (Microelectron. Reliab., 2007)

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. - Chan-Yen Chou; Tuan-Yu Hung; Shin-Yueh Yang; Ming-Chih Yew; Wen-Kun Yang; Kuo-Ning Chiang (Microelectron. Reliab., 2008)

The mechanical stress resistance capability of stress buffer structures in analog devices. - Hsiao-Tung Ku; Kuo-Ning Chiang (Microelectron. Reliab., 2008)

Fabrication process simulation and reliability improvement of high-brightness LEDs. - Tsung-Lin Chou; Chien-Fu Huang; Cheng-Nan Han; Shin-Yueh Yang; Kuo-Ning Chiang (Microelectron. Reliab., 2009)

Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III-V material. - Tsung-Lin Chou; Shin-Yueh Yang; Chung-Jung Wu; Cheng-Nan Han; Kuo-Ning Chiang (Microelectron. Reliab., 2011)

Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test. - T. Y. Hung; S. Y. Chiang; C. J. Huang; Chang-Chun Lee; Kuo-Ning Chiang (Microelectron. Reliab., 2011)

Light degradation test and design of thermal performance for high-power light-emitting diodes. - Yen-Fu Su; Shin-Yueh Yang; Tuan-Yu Hung; Chang-Chun Lee; Kuo-Ning Chiang (Microelectron. Reliab., 2012)

Characterization on acceleration-factor equation for packaging-solder joint reliability. - K.-C. Wu; Kuo-Ning Chiang (Microelectron. Reliab., 2016)