Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs). - Kyoung-Lim Suk; Kyosung Choo; Sung Jin Kim; Jong-Soo Kim; Kyung-Wook Paik (Microelectron. Reliab., 2012)

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). - Kyoung-Lim Suk; Ho-Young Son; Chang-Kyu Chung; Joong Do Kim; Jin-Woo Lee; Kyung-Wook Paik (Microelectron. Reliab., 2012)