Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives. - Byeung-Gee Kim; Sang-Mok Lee; Yun-Song Jo; Sun-Chul Kim; Kyoung-Moo Harr; Young-Ho Kim (Microelectron. Reliab., 2011)

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive. - Kyoung-Moo Harr; Sun-Chul Kim; Young-Min Kim; Young-Ho Kim (Microelectron. Reliab., 2015)