Isothermal aging characteristics of Sn-Pb micro solder bumps. - Kyung-Seob Kim; C. H. Yu; Nam-Hoon Kim; N. K. Kim; H. J. Chang; E. G. Chang (Microelectron. Reliab., 2003)

Fatigue analysis of high-speed photodiode submodule by using FEM. - Kyung-Seob Kim; H. I. Kim; C. H. Yu; E. G. Chang (Microelectron. Reliab., 2004)

The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces. - Kyung-Seob Kim; K. W. Ryu; C. H. Yu; J. M. Kim (Microelectron. Reliab., 2005)

Tin whisker formation of lead-free plated leadframes. - Kyung-Seob Kim; C. H. Yu; J. M. Yang (Microelectron. Reliab., 2006)

Investigation of relation between intermetallic and tin whisker growths under ambient condition. - Kyung-Seob Kim; C. H. Yu; S. W. Han; K. C. Yang; J. H. Kim (Microelectron. Reliab., 2008)