Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. - Woon-Seong Kwon; Suk-Jin Ham; Kyung-Wook Paik (Microelectron. Reliab., 2006)

Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. - Se Young Yang; Young-Doo Jeon; Soon-Bok Lee; Kyung-Wook Paik (Microelectron. Reliab., 2006)

Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications. - Kyung-Woon Jang; Chang-Kyu Chung; Woong-Sun Lee; Kyung-Wook Paik (Microelectron. Reliab., 2008)

Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications. - Chang-Kyu Chung; Jae-Han Kim; Jong-Won Lee; Kyoung-Won Seo; Kyung-Wook Paik (Microelectron. Reliab., 2012)

A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages. - Kyung-Woon Jang; Jin-Hyoung Park; Soon-Bok Lee; Kyung-Wook Paik (Microelectron. Reliab., 2012)

Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs). - Kyoung-Lim Suk; Kyosung Choo; Sung Jin Kim; Jong-Soo Kim; Kyung-Wook Paik (Microelectron. Reliab., 2012)

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). - Kyoung-Lim Suk; Ho-Young Son; Chang-Kyu Chung; Joong Do Kim; Jin-Woo Lee; Kyung-Wook Paik (Microelectron. Reliab., 2012)

Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 μm pitch Cu-pillar/Sn-Ag bump interconnection. - Jiwon Shin; Il Kim; Yong-Won Choi; Young Soon Kim; Un Byung Kang; Young Kun Jee; Kyung-Wook Paik (Microelectron. Reliab., 2015)

Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly. - Shuye Zhang; Tiesong Lin; Peng He; Kyung-Wook Paik (Microelectron. Reliab., 2017)

FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays. - Taemin Lee; Joontaek Jung; Sang-Mok Lee; Jongcheol Park; Jae-Hyeong Park; Kyung-Wook Paik; Hyunjoo J. Lee (Sensors, 2022)