Development of 7th generation 3D VNAND Flash Product with COP structure for Growing Demand in Storage Market. - Joonsung Lim; Soochan Chung; Dong-Hyeon Ko; Suk-Kang Sung; Kyungyoon Noh; Sujin Ahn; Jai Hyuk Song (ICEIC, 2022)

Process Improvements for 7th Generation 1Tb Quad-Level Cell 3D NAND Flash Memory in Mass Production. - Soochan Chung; Dong-Hyeon Ko; Joonsung Lim; Kyungmoon Kim; Sejie Takaki; Yujeong Seo; Byoungil Lee; Sejun Park; Jaeduk Lee; Kyungyoon Noh; Sujin Ahn; Sunghoi Hur (IMW, 2023)

High Bit Cost Scalability and Reliable Cell Characteristics for 7th Generation 1Tb 4Bit/Cell 3D-NAND Flash. - Kyungmoon Kim; Yujeong Seo; Sejun Park; Woojae Jang; Dongho Yoo; Joonsung Lim; Il-Han Park; Jaeduk Lee; Kyungyoon Noh; Sujin Ahn; Sunghoi Hur (VLSI Technology and Circuits, 2023)

On-Chip Capacitors with Wall-Type Structure in 9th Generation 3D VNAND Flash Memory. - Taegon Lee; Ji-Eun Ha; Kang-In Lee; Jung-Hwan Lee; Hyung-Geun Yook; In-Chul Shin; Jang-Hwan Jeong; Minkyu Kang; Joonsung Lim; Kyungyoon Noh; Seungwan Hong; Sunghoi Hur (IMW, 2025)

New Burnout Failure at the Chip Edge: Analysis and Preventive Design by a Novel Experimental Approach. - Seungmin Lee; Taegon Lee; Gaeun Kim; Kwang-Ryul Lee; Eunji An; Sekwon Hong; Sungjun Kim; Soonkwan Kang; Seokwoo Hong; Hwan Cha; Minkyu Kang; Jaesun Yun; et al. (IRPS, 2025)