A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. - Robin C. J. Wang; Chang-Chun Lee; L. D. Chen; Kenneth Wu; K. S. Chang-Liao (Microelectron. Reliab., 2006)

Study of a new electromigration failure mechanism by novel test structure. - L. D. Chen; B. L. Lin; M.-H. Hsieh; C. W. Chang; J. S. Tsai; J. C. Peng; C. C. Chiu; Y.-H. Lee (IRPS, 2015)