Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution. - L. Hua; C. Yang (Microelectron. Reliab., 2011)

Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards. - L. Hua; H. N. Hou (Microelectron. Reliab., 2017)