Investigation of the heel crack mechanism in Al connections for power electronics modules. - Y. Celnikier; Lahouari Benabou; Laurent Dupont 002; Gerard Coquery (Microelectron. Reliab., 2011)

Optimization of wire connections design for power electronics. - Y. Celnikier; Laurent Dupont 002; E. Hervé; Gerard Coquery; Lahouari Benabou (Microelectron. Reliab., 2011)

Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling. - Van Nhat Le; Lahouari Benabou; Victor Etgens; Quang Bang Tao (Microelectron. Reliab., 2016)

Systematic Review of Prosthetic Socket Fabrication using 3D printing. - Kim-Thanh Nguyen; Lahouari Benabou; Samer Alfayad (ICMRE, 2018)