Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology. - Lars Brusberg; Christian Herbst; Marcel Neitz; Henning Schröder; Klaus-Dieter Lang (ECOC, 2014)

High performance ion-exchanged integrated waveguides in thin glass for board-level multimode optical interconnects. - Lars Brusberg; Henning Schröder; Christian Herbst; Christopher Frey; Christian Fiebig; Aramais R. Zakharian; Sergey A. Kuchinsky; Xue Liu; Davide Fortusini; Alan F. Evans (ECOC, 2015)

PhoxTroT - a European initiative toward low cost and low power photonic interconnects for data centres. - Andreas Håkansson; Tolga Tekin; Lars Brusberg; Nikos Pleros; Costas Vyrsokinos; Dimitris Apostolopoulos; Richard Pitwon; Allen M. Miller; Kai Wang; Domenico Tulli; Sander Dorrestein; Rutger Smink; et al. (ICTON, 2015)

Single-mode board-level interconnects for silicon photonics. - Lars Brusberg; Dionysios Manessis; Christian Herbst; Marcel Neitz; Beatrice Schild; Michael Topper; Henning Schröder; Tolga Tekin (OFC, 2015)

Fiber-to-Waveguide Connector for Co-Packaged Optics. - Lars Brusberg; Michael DeJong; Margaret Allen; Ramsey Selim; Douglas L. Butler; Jeffrey S. Clark; Clifford G. Sutton; Grahame Wood; Henk Bulthuis; Drew Lundsten; Jamie Stokes (ECOC, 2017)

Optoelectronic Glass Substrates for Co-Packaging of Optics and ASICs. - Lars Brusberg; Aramais R. Zakharian; Sükrü Ekin Kocabas; Jason R. Grenier; Chad C. Terwilliger; Alan F. Evans (OFC, 2020)

Passive Aligned Glass Waveguide Connector for Co-Packaged Optics. - Lars Brusberg; Jason R. Grenier; Jürgen Matthies; Allen M. Miller; Chad C. Terwilliger; Jeffrey S. Clark; Beibei Zeng; Pierre Beneke (ECOC, 2021)

Glass Interposer for High-Density Photonic Packaging. - Lars Brusberg; Jason R. Grenier; Sükrü Ekin Kocabas; Aramais R. Zakharian; Lucas W. Yeary; Daniel W. Levesque; Barry J. Paddock; Robert A. Bellman; Robin M. Force; Chad C. Terwilliger; Clifford G. Sutton; Jeffrey S. Clark; et al. (OFC, 2022)

Slim Push-Pull Fiber Array Connector for Optical Chips. - Lars Brusberg; Jürgen Matthies; Jason R. Grenier; Jeffrey S. Clark; Betsy J. Johnson; Chad C. Terwilliger (OFC, 2023)

Integrated Glass Waveguide Circuit for Co-packaged Optics in Radio-Access Networks. - Lars Brusberg; Alessandra Bigongiari; Lucas W. Yeary; Jason R. Grenier; Binas Nisic; Stefano Stracca; Chad C. Terwilliger; Jeffrey S. Clark (OFC, 2025)

High-density Evanescent Chip Coupling with Detachable Fiber Connector for Co-packaged Optics. - Lars Brusberg; Jorge A. Holguin-Lerma; Janderson R. Rodrigues; Betsy J. Johnson; Jason R. Grenier; Marissa Granados-Baez; Robin M. Force; Aramais R. Zakharian; Chad C. Terwilliger; Katerina Rousseva (OFC, 2025)