Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips. - Weishen Chu; Laura Spinella; Dwayne R. Shirley; Paul S. Ho (IRPS, 2020)

Common Cause Failure Assessment Suitable for a System on a Chip Design According to ISO 13849 Standard. - Elisa Spano; Alessandro Campinoti; Laura Spinella (ICSRS, 2024)