Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. - Laurent Dupont 002; Zoubir Khatir; Stéphane Lefebvre; S. Bontemps (Microelectron. Reliab., 2006)

Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions. - M. Bouarroudj; Zoubir Khatir; Jean-Pierre Ousten; F. Badel; Laurent Dupont 002; Stéphane Lefebvre (Microelectron. Reliab., 2007)

Failure modes on low voltage power MOSFETs under high temperature application. - Laurent Dupont 002; Stéphane Lefebvre; M. Bouaroudj; Zoubir Khatir; Jean-Claude Faugières (Microelectron. Reliab., 2007)

Accelerated active ageing test on SiC JFETs power module with silver joining technology for high temperature application. - Laurent Dupont 002; Gerard Coquery; K. Kriegel; A. Melkonyan (Microelectron. Reliab., 2009)

Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode. - Laurent Dupont 002; J. L. Blanchard; Richard Lallemand; Gerard Coquery; Jean-Michel Morelle; G. Blondel; B. Rouleau (Microelectron. Reliab., 2010)

Investigations on junction temperature estimation based on junction voltage measurements. - Zoubir Khatir; Laurent Dupont 002; Ali Ibrahim (Microelectron. Reliab., 2010)

Investigation of the heel crack mechanism in Al connections for power electronics modules. - Y. Celnikier; Lahouari Benabou; Laurent Dupont 002; Gerard Coquery (Microelectron. Reliab., 2011)

Optimization of wire connections design for power electronics. - Y. Celnikier; Laurent Dupont 002; E. Hervé; Gerard Coquery; Lahouari Benabou (Microelectron. Reliab., 2011)

Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions - Comparison with infrared measurements. - Yvan Avenas; Laurent Dupont 002 (Microelectron. Reliab., 2012)

Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters. - Nick Baker; Marco Liserre; Laurent Dupont 002; Yvan Avenas (IECON, 2013)

Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions. - Son-Ha Tran; Laurent Dupont 002; Zoubir Khatir (Microelectron. Reliab., 2014)