20-nm In0.8Ga0.2As MOSHEMT MMIC Technology on Silicon. - Axel Tessmann; Arnulf Leuther; Felix Heinz; Frank Bernhardt; Laurenz John; Hermann Massler; Lukas Czornomaz; Thomas Merkle (IEEE J. Solid State Circuits, 2019)

Comparison of active dual-gate and passive mixers for terahertz applications. - Christopher M. Grötsch; Iulia Dan; Laurenz John; Sandrine Wagner; Ingmar Kallfass (IET Circuits Devices Syst., 2021)

Short-Range Full-Duplex Real-Time Wireless Terahertz Link for IEEE802.15.3d Applications. - Dominik Wrana; Yigal Leiba; Laurenz John; Benjamin Schoch; Axel Tessmann; Ingmar Kallfass (RWS, 2022)

Multi-Channel PA, LNA, and Switch MMICs for Beam-Switching Applications at 160 GHz, Based on an InGaAs mHEMT Technology. - Laurenz John; Thomas Merkle; Arnulf Leuther; Jaehoon Chung (BCICTS, 2023)

Advanced mHEMT Technologies for Use in Radar, Communication and Meteorological Applications. - Axel Tessmann; Arnulf Leuther; Fabian Thome; Laurenz John; Bersant Gashi; Hermann Massler; Alexander Saam; Sébastien Chartier (BCICTS, 2023)

InGaAs HEMT Technology for Submillimeter-Wave and Ultra-Wideband Monolithic Integrated Circuits. - Fabian Thome; Laurenz John; Bersant Gashi; Axel Tessmann; Arnulf Leuther; Sébastien Chartier (IGARSS, 2023)

Ultra-Low-Noise 50-nm InGaAs mHEMT Technology and MMICs for Room Temperature and Cryogenic Applications. - Fabian Thome; Laurenz John; Rainer Weber; Felix Heinz; Hermann Massler; Arnulf Leuther; Sébastien Chartier (IGARSS, 2023)

Broadband InGaAs mHEMT THz Transmitters and Receivers. - Laurenz John; Fabian Thome; Arnulf Leuther; Axel Tessmann (OFC, 2024)

Sub-THz D-Band Integrated Analog Beamforming Front-End Prototyping and 6G Outdoor Trials. - Ramez Askar; Mathis Schmieder; Jaehoon Chung; Laurenz John; Thomas Merkle; Sven Wittig; Yonghak Suh; Jongpil Lee; Michael Peter; Thomas Haustein; Wilhelm Keusgen; Slawomir Stanczak (WCNC, 2024)

Mobilizing the Terahertz Beam: D-Band Analog-Beamforming Front-End Prototyping and Long-Range 6G Trials. - Ramez Askar; Jaehoon Chung; Laurenz John; Thomas Merkle; Sven Wittig; Mathis Schmieder; Yonghak Suh; Jongpil Lee; Benjamin Baumann; Michael Peter; Thomas Haustein; Wilhelm Keusgen; et al. (IEEE Wirel. Commun., 2024)