Nondestructive Inspection and Quantification of Soldering Defects in PCB Using an Autofocusing Digital Holographic Camera. - Gaurav Dwivedi; Lavlesh Pensia; Viney Lohchab; Raj Kumar (IEEE Trans. Instrum. Meas., 2023)

Dual Field-of-View Off-Axis Spatially Multiplexed Digital Holography Using Fresnel's Bi-Mirror. - Lavlesh Pensia; Manoj Kumar; Raj Kumar (Sensors, 2024)

Vibration Measurement of 3-D Objects With Single-Shot Double Field-of-View High-Speed Digital Holography. - Manoj Kumar; Lavlesh Pensia; Raj Kumar; Osamu Matoba (IEEE Trans. Instrum. Meas., 2025)