3D Capacitive Interconnections for High Speed Interchip Communication. - Roberto Canegallo; Alberto Fazzi; Luca Ciccarelli; Luca Magagni; Federico Natali; Pier Luigi Rolandi; Erik Jung; Léa Di Cioccio; Roberto Guerrieri (CICC, 2007)

3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly. - Alberto Fazzi; Luca Magagni; Mauro Mirandola; Barbara Charlet; Léa Di Cioccio; Erik Jung; Roberto Canegallo; Roberto Guerrieri (IEEE J. Solid State Circuits, 2007)

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. - Léa Di Cioccio; Pierric Gueguen; Rachid Taibi; Thomas Signamarcheix; Laurent Bally; Laurent Vandroux; Marc Zussy; Sophie Verrun; Jérôme Dechamp; Patrick Leduc; Myriam Assous; David Bouchu; et al. (3DIC, 2009)

First integration of Cu TSV using die-to-wafer direct bonding and planarization. - Patrick Leduc; Myriam Assous; Léa Di Cioccio; Marc Zussy; Thomas Signamarcheix; Antonio Roman; Maxime Rousseau; Sophie Verrun; Laurent Bally; David Bouchu; Lionel Cadix; Alexis Farcy; et al. (3DIC, 2009)

System on Wafer: A New Silicon Concept in SiP. - Gilles Poupon; Nicolas Sillon; David Henry; Charlotte Gillot; Alan Mathewson; Léa Di Cioccio; Barbara Charlet; Patrick Leduc; Maud Vinet; Perrine Batude (Proc. IEEE, 2009)

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. - Ionut Radu; Didier Landru; Gweltaz Gaudin; Gregory Riou; Catherine Tempesta; Fabrice Letertre; Léa Di Cioccio; Pierric Gueguen; Thomas Signamarcheix; C. Euvrard; Jérôme Dechamp; Laurent Clavelier; et al. (3DIC, 2010)

200°C direct bonding copper interconnects : Electrical results and reliability. - Léa Di Cioccio; Rachid Taibi; Cédrick Chappaz; Stéphane Moreau; Laurent-Luc Chapelon; Thomas Signamarcheix (3DIC, 2011)

Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield. - Sebastien Mermoz; Loic Sanchez; Léa Di Cioccio; Jean Berthier; Emilie Deloffre; Christian Fretigny (3DIC, 2011)

Low temperature direct bonding: An attractive technique for heterostructures build-up. - H. Moriceau; F. Rieutord; F. Fournel; Léa Di Cioccio; C. Moulet; Luc Libralesso; Pierric Gueguen; Rachid Taibi; C. Deguet (Microelectron. Reliab., 2012)

Chip to wafer copper direct bonding electrical characterization and thermal cycling. - Yann Beilliard; Perceval Coudrain; Léa Di Cioccio; Stéphane Moreau; Loic Sanchez; Brigitte Montmayeul; Thomas Signamarcheix; Rafael Estevez; Guillaume Parry (3DIC, 2013)

Novel low temperature 3D wafer stacking technology for high density device integration. - Ionut Radu; Gweltaz Gaudin; William van den Daele; Fabrice Letertre; Carlos Mazure; Léa Di Cioccio; Thomas Lacave; Frederic Mazen; Pascal Scheiblin; Thomas Signamarcheix; Sorin Cristoloveanu (ESSDERC, 2013)

Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration. - Mariam Sadaka; Ionut Radu; Chrystelle Lagahe-Blanchard; Léa Di Cioccio (ICICDT, 2013)

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. - Yann Beilliard; Stéphane Moreau; Léa Di Cioccio; Perceval Coudrain; G. Romano; A. Nowodzinski; F. Aussenac; P.-H. Jouneau; E. Rolland; Thomas Signamarcheix (3DIC, 2014)

Toward Eco-Design of a 5G mmWave Transmitarray Antenna Based on Life Cycle Assessment. - Josua Guérid; Jean-Baptiste Doré; Jacques Reverdy; Bruno Reig; Antonio Clemente; Léa Di Cioccio (EuCNC, 2022)