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Reliability Characterization for 12 V Application Using the 22FFL FinFET Technology. - Chen-Yi Su; Mark Armstrong; Sunny Chugh; Mohammed El-tanani; Hannes Greve; Hai Li 008; Mahjabin Maksud; Benjamin Orr; Christopher Perini; James Palmer 002; Leif Paulson; Stephen Ramey; et al. (IRPS, 2020)

Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing. - Walid M. Hafez; P. Agnihotri; M. Asoro; M. Aykol; B. Bains; Rohan Bambery; M. Bapna; A. Barik; A. Chatterjee; P. C. Chiu; T. Chu; C. Firby; et al. (VLSI Technology and Circuits, 2023)