Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. - Julien Magnien; Lisa Mitterhuber; Jördis Rosc; Franz Schrank; Stefan Hörth; Lena Goullon; Matthias Hutter; Stefan Defregger; Elke Kraker (Microelectron. Reliab., 2017)

Thermal transient measurement and modelling of a power cycled flip-chip LED module. - Lisa Mitterhuber; Stefan Defregger; Julien Magnien; Jördis Rosc; René Hammer; Lena Goullon; Matthias Hutter; Franz Schrank; Stefan Hörth; Elke Kraker (Microelectron. Reliab., 2018)