Prediction and verification of process induced warpage of electronic packages. - W. D. van Driel; G. Q. Zhang; J. H. J. Janssen; Leo J. Ernst; Fei Su; Kerm Sin Chian; Sung Yi (Microelectron. Reliab., 2003)

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. - Willem D. van Driel; C. J. Liu; G. Q. Zhang; J. H. J. Janssen; Richard B. R. van Silfhout; Marcel A. J. van Gils; Leo J. Ernst (Microelectron. Reliab., 2004)

Prediction of thermo-mechanical integrity of wafer backend processes. - Viktor Gonda; Jaap M. J. den Toonder; Johan Beijer; G. Q. Zhang; Willem D. van Driel; Romano J. O. M. Hoofman; Leo J. Ernst (Microelectron. Reliab., 2004)

Prediction of crack growth in IC passivation layers. - Y. T. He; Marcel A. J. van Gils; Willem D. van Driel; G. Q. Zhang; Richard B. R. van Silfhout; Leo J. Ernst (Microelectron. Reliab., 2004)

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. - Dao-Guo Yang; J. S. Liang; Quan-Yong Li; Leo J. Ernst; G. Q. Zhang (Microelectron. Reliab., 2004)

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. - Cadmus A. Yuan; Willem D. van Driel; Richard B. R. van Silfhout; Olaf van der Sluis; Roy A. B. Engelen; Leo J. Ernst; Fred van Keulen; G. Q. Zhang (Microelectron. Reliab., 2006)

Correlation between chemistry of polymer building blocks and microelectronics reliability. - H. J. L. Bressers; W. D. van Driel; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang (Microelectron. Reliab., 2007)

Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. - Tomasz Falat; Artur Wymyslowski; Jana Kolbe; Kaspar M. B. Jansen; Leo J. Ernst (Microelectron. Reliab., 2007)

Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. - Viktor Gonda; Kaspar M. B. Jansen; Leo J. Ernst; Jaap M. J. den Toonder; G. Q. Zhang (Microelectron. Reliab., 2007)

Novel shear tools for viscoelastic characterization of packaging polymers. - C. van't Hof; Kaspar M. B. Jansen; G. Wisse; Leo J. Ernst; Dao-Guo Yang; G. Q. Zhang; H. J. L. Bressers (Microelectron. Reliab., 2007)

Characterization of moisture properties of polymers for IC packaging. - Xiaosong Ma; Kaspar M. B. Jansen; Leo J. Ernst; W. D. van Driel; Olaf van der Sluis; G. Q. Zhang (Microelectron. Reliab., 2007)

Measuring the through-plane elastic modulus of thin polymer films in situ. - M. van Soestbergen; Leo J. Ernst; Kaspar M. B. Jansen; W. D. van Driel (Microelectron. Reliab., 2007)

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. - Dao-Guo Yang; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang; H. J. L. Bressers; J. H. J. Janssen (Microelectron. Reliab., 2007)

Numerical modeling of warpage induced in QFN array molding process. - Dao-Guo Yang; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang; W. D. van Driel; H. J. L. Bressers; J. H. J. Janssen (Microelectron. Reliab., 2007)

Molecular simulation on the material/interfacial strength of the low-dielectric materials. - Cadmus A. Yuan; Olaf van der Sluis; G. Q. (Kouchi) Zhang; Leo J. Ernst; Willem D. van Driel; Richard B. R. van Silfhout (Microelectron. Reliab., 2007)

Modeling and characterization of molding compound properties during cure. - Kaspar M. B. Jansen; C. Qian; Leo J. Ernst; C. Bohm; A. Kessler; Harald Preu; Matthias Stecher (Microelectron. Reliab., 2009)

A fast moisture sensitivity level qualification method. - Xiaosong Ma; Kaspar M. B. Jansen; G. Q. Zhang; Willem D. van Driel; Olaf van der Sluis; Leo J. Ernst; C. Regards; Christian Gautier; Hélène Frémont (Microelectron. Reliab., 2010)

Prediction of cure induced warpage of micro-electronic products. - Jan de Vreugd; Kaspar M. B. Jansen; Leo J. Ernst; C. Bohm (Microelectron. Reliab., 2010)

Characterization of the viscoelastic properties of an epoxy molding compound during cure. - M. Sadeghinia; Kaspar M. B. Jansen; Leo J. Ernst (Microelectron. Reliab., 2012)