Leong Ching Wai

According to our database1, Leong Ching Wai authored at least 3 papers between 2009 and 2012.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2012
Modular sensor chip design for package stress evaluation and reliability characterisation.
Microelectronics Reliability, 2012

2010
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.
Microelectronics Reliability, 2010

2009
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.
Microelectronics Reliability, 2009


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