Leong Ching Wai
According to our database1, Leong Ching Wai authored at least 4 papers between 2009 and 2019.
Legend:Book In proceedings Article PhD thesis Other
Development of Six-Degree-of-Freedom Inertial Sensors With an 8-in Advanced MEMS Fabrication Platform.
IEEE Trans. Industrial Electronics, 2019
Modular sensor chip design for package stress evaluation and reliability characterisation.
Microelectronics Reliability, 2012
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.
Microelectronics Reliability, 2010
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.
Microelectronics Reliability, 2009