Leong Ching Wai
According to our database1, Leong Ching Wai authored at least 3 papers between 2009 and 2012.
Legend:Book In proceedings Article PhD thesis Other
Modular sensor chip design for package stress evaluation and reliability characterisation.
Microelectronics Reliability, 2012
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.
Microelectronics Reliability, 2010
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.
Microelectronics Reliability, 2009