3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications. - Leonhard Hahn; Tim Pfahler; Tobias Bader; Gerald Gold; Martin Vossiek; Christian Carlowitz (CoRR, 2024)

3D-Printed Broadband Dielectric Image Line Splitters for sub-THz Applications. - Leonhard Hahn; Maximilian Gloßner; Lukas Bürk; Christian Carlowitz; Gerald Gold; Martin Vossiek (RWS, 2025)