Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI). - Guruprasad Katti; S. W. Ho; Li Hong Yu; Songbai Zhang; Rahul Dutta; Roshan Weerasekera; Ka-Fai Chang; Jong-Kai Lin; Srinivasa Rao Vempati; Surya Bhattacharya (IEEE Des. Test, 2015)