Li Wang

Affiliations:
  • Skyworks Solutions, Newbury Park, CA, USA
  • University of California, Riverside, CA, USA (PhD 2015)


According to our database1, Li Wang authored at least 11 papers between 2012 and 2017.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2017
More-Than-Moore: 3D heterogeneous integration into CMOS technologies.
Proceedings of the 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2017

2016
A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS.
IEEE Trans. Circuits Syst. I Regul. Pap., 2016

2015
Function-based ESD protection circuit design verification for BGA pad-ring array.
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015

2014
Concurrent Design Analysis of High-Linearity SP10T Switch With 8.5 kV ESD Protection.
IEEE J. Solid State Circuits, 2014

Scalable behavior modeling for SCR based ESD protection structures for circuit simulation.
Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014

2013
Post-Si Programmable ESD Protection Circuit Design: Mechanisms and Analysis.
IEEE J. Solid State Circuits, 2013

Heterogeneous integration of nano enabling devices for 3D ICs.
Proceedings of the International Symposium on Low Power Electronics and Design (ISLPED), 2013

Design and analysis of full-chip HV ESD protection in BCD30V for mixed-signal ICs.
Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

Scalable behavior modeling for 3D field-programmable ESD protection structures.
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013

A smartphone SP10T T/R switch in 180-nm SOI CMOS with 8kV+ ESD protection by co-design.
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013

2012
A design technique overview on broadband RF ESD protection circuit designs.
Proceedings of the 55th IEEE International Midwest Symposium on Circuits and Systems, 2012


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