Application of multi-fidelity simulation modelling to integrated circuit packaging. - Liam Y. Hsieh; Edward Huang; Chun-Hung Chen; Si Zhang; Kuo-Hao Chang (Int. J. Simul. Process. Model., 2016)

Simulation optimization in the era of Industrial 4.0 and the Industrial Internet. - Jie Xu 004; Edward Huang; Liam Y. Hsieh; Loo Hay Lee; Qing-Shan Jia; Chun-Hung Chen (J. Simulation, 2016)

Determination of Wafer Start Mix in Semiconductor Manufacturing During New Technology Ramp-Up: Model, Solution Method, and an Empirical Study. - Kuo-Hao Chang; Liam Y. Hsieh (IEEE Trans. Syst. Man Cybern. Syst., 2016)

Optimal Parallel Machine Allocation Problem in IC Packaging Using IC-PSO: An Empirical Study. - Robert Cuckler; Kuo-Hao Chang; Liam Y. Hsieh (Asia Pac. J. Oper. Res., 2017)