An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks. - Shaobin Ma; Xiaoyi Wang; Sheldon X.-D. Tan; Liang Chen 025; Jian He (ASP-DAC, 2020)

Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires. - Mohammadamir Kavousi; Liang Chen 025; Sheldon X.-D. Tan (ICCAD, 2020)

Data-Driven Fast Electrostatics and TDDB Aging Analysis. - Shaoyi Peng; Wentian Jin; Liang Chen 025; Sheldon X.-D. Tan (MLCAD, 2020)

Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. - Liang Chen 025; Sheldon X.-D. Tan; Zeyu Sun 001; Shaoyi Peng; Min Tang; Junfa Mao (IEEE Trans. Very Large Scale Integr. Syst., 2020)

EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks. - Wentian Jin; Liang Chen 025; Sheriff Sadiqbatcha; Shaoyi Peng; Sheldon X.-D. Tan (DAC, 2021)

Robust power grid network design considering EM aging effects for multi-segment wires. - Han Zhou 002; Liang Chen 025; Sheldon X.-D. Tan (Integr., 2021)

A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. - Liang Chen 025; Sheldon X.-D. Tan; Zeyu Sun 001; Shaoyi Peng; Min Tang; Junfa Mao (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021)

Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution. - Xiaoyi Wang; Shaobin Ma; Sheldon X.-D. Tan; Chase Cook; Liang Chen 025; Jianlei Yang 001; Wenjian Yu (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021)

Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks. - Liang Chen 025; Wentian Jin; Sheldon X.-D. Tan (ASP-DAC, 2022)

Fast Electromigration Stress Analysis Considering Spatial Joule Heating Effects. - Mohammadamir Kavousi; Liang Chen 025; Sheldon X.-D. Tan (ASP-DAC, 2022)

HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network. - Wentian Jin; Liang Chen 025; Subed Lamichhane; Mohammadamir Kavousi; Sheldon X.-D. Tan (ICCAD, 2022)

Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach. - Liang Chen 025; Sheriff Sadiqbatcha; Hussam Amrouch; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022)

Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks. - Liang Chen 025; Jincong Lu; Wentian Jin; Sheldon X.-D. Tan (ICCAD, 2023)

PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks. - Subed Lamichhane; Wentian Jin; Liang Chen 025; Mohammadamir Kavousi; Sheldon X.-D. Tan (ICCAD, 2023)

Hot-spot aware thermoelectric array based cooling for multicore processors. - Jinwei Zhang; Sheriff Sadiqbatcha; Liang Chen 025; Cuong Thi; Sachin Sachdeva; Hussam Amrouch; Sheldon X.-D. Tan (Integr., 2023)

Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression. - Liang Chen 025; Wentian Jin; Mohammadamir Kavousi; Subed Lamichhane; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023)

Thermoelectric Cooler Modeling and Optimization via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks. - Liang Chen 025; Wentian Jin; Jinwei Zhang; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023)

Thermal Resistance Network Derivative (TREND) Model for Efficient Thermal Simulation and Design of ICs and Packages. - Shunxiang Lan; Min Tang; Liang Chen 025; Junfa Mao (DAC, 2024)

PISOV: Physics-Informed Separation of Variables Solvers for Full-Chip Thermal Analysis. - Liang Chen 025; Wenxing Zhu; Min Tang; Sheldon X.-D. Tan; Jun-Fa Mao; Jianhua Zhang (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2025)

Delay-Driven Rectilinear Steiner Tree Construction. - Hongxi Wu; Xingquan Li; Liang Chen 025; Bei Yu 001; Wenxing Zhu (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2025)