Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module. - Stefaan Van Huylenbroeck; Yunlong Li; Michele Stucchi; Lieve Bogaerts; Joeri De Vos; Gerald Beyer; Eric Beyne; Mohand Brouri; Praveen Nalla; Sanjay Gopinath; Matthew Thorum; Joe Richardson; et al. (3DIC, 2016)

Packaging and Assembly Challenges for 50G Silicon Photonics Interposers. - Bradley Snyder; Nivesh Mangal; Guy Lepage; Sadhishkumar Balakrishnan; Xiao Sun; Nicolas Pantano; Michal Rakowski; Lieve Bogaerts; Peter De Heyn; Peter Verheyen; Andy Miller; Marianna Pantouvaki; et al. (OFC, 2018)

110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules. - Kenichi Miyaguchi; Yoojin Ban; Nicolas Pantano; Xiao Sun; Philippe Absil; Lieve Bogaerts; Peter Verheyen; Dimitrios Velenis; Marianna Pantouvaki; Joris Van Campenhout (ECOC, 2021)