Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. - Bart Vandevelde; Filip Vanhee; Davy Pissoort; Lieven Degrendele; Johan de Baets; Bart Allaert; Ralph Lauwaert; Franco Zanon; Riet Labie; Geert Willems (Microelectron. Reliab., 2017)