Microstructures and properties of Bi10Ag high temperature solder doped with Cu element. - Limeng Yin; Dong Li; Zongxiang Yao; Gang Wang; Adrian Blackburn (Microelectron. Reliab., 2018)

Effect of Ti Content on the Microstructure and Properties of CoCrFeNiMnTix High Entropy Alloy. - Yuhua Chen; Wenkuo Liu; Hongwei Wang; Jilin Xie; Timing Zhang; Limeng Yin; Yongde Huang (Entropy, 2022)