Study on Steering by Wire Controller Based on Improved H∞ Algorithm. - Huipeng Chen; Lingjun Zhu; Xiaofan Liu; Sunan Yu; Dingcheng Zhao (Int. J. Online Eng., 2013)

A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology. - Sai Pentapati; Lingjun Zhu; Lennart Bamberg; Da Eun Shim; Alberto García Ortiz; Sung Kyu Lim (IEEE Micro, 2019)

The Financial Archives Management System of University Based on Computer Network Technology. - Lingjun Zhu (CSIA (2), 2020)

TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs. - Yi-Chen Lu; Sai Surya Kiran Pentapati; Lingjun Zhu; Kambiz Samadi; Sung Kyu Lim (DAC, 2020)

Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs. - Lennart Bamberg; Alberto García Ortiz; Lingjun Zhu; Sai Pentapati; Da Eun Shim; Sung Kyu Lim (DATE, 2020)

Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs. - Lingjun Zhu; Kyungwook Chang; Dusan Petranovic; Saurabh Sinha; Yun Seop Yu; Sung Kyu Lim (ISPD, 2020)

Flow Event Telemetry on Programmable Data Plane. - Yu Zhou 008; Chen Sun 005; Hongqiang Harry Liu; Rui Miao 001; Shi Bai; Bo Li 061; Zhilong Zheng; Lingjun Zhu; Zhen Shen; Yongqing Xi; Pengcheng Zhang; Dennis Cai; et al. (SIGCOMM, 2020)

Heterogeneous 3D Integration for a RISC-V System With STT-MRAM. - Lingjun Zhu; Lennart Bamberg; Anthony Agnesina; Francky Catthoor; Dragomir Milojevic; Manu Komalan; Julien Ryckaert; Alberto García-Ortiz; Sung Kyu Lim (IEEE Comput. Archit. Lett., 2020)

Vortex: OpenCL Compatible RISC-V GPGPU. - Fares Elsabbagh; Blaise Tine; Priyadarshini Roshan; Ethan Lyons; Euna Kim; Da Eun Shim; Lingjun Zhu; Sung Kyu Lim; Hyesoon Kim (CoRR, 2020)

Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. - Jinwoo Kim; Lingjun Zhu; Hakki Mert Torun; Madhavan Swaminathan; Sung Kyu Lim (DAC, 2021)

Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture. - Lingjun Zhu; Tuan Ta; Rossana Liu; Rahul Mathur; Xiaoqing Xu; Shidhartha Das; Ankit Kaul; Alejandro Rico; Doug Joseph; Brian Cline; Sung Kyu Lim (ISLPED, 2021)

Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies. - Lingjun Zhu; Sung Kyu Lim (ISPD, 2021)

Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators. - Jan Moritz Joseph; Ananda Samajdar; Lingjun Zhu; Rainer Leupers; Sung Kyu Lim; Thilo Pionteck; Tushar Krishna (ISQED, 2021)

Identification of key genes, pathways, and associated comorbidities in chikungunya infection: insights from system biology analysis. - Lingjun Zhu; Xiaodong Wang; Tania Akter Asa; Md. Ali Hossain (Netw. Model. Anal. Health Informatics Bioinform., 2021)

High-Performance Logic-on-Memory Monolithic 3-D IC Designs for Arm Cortex-A Processors. - Lingjun Zhu; Lennart Bamberg; Sai Surya Kiran Pentapati; Kyungwook Chang; Francky Catthoor; Dragomir Milojevic; Manu Komalan; Brian Cline; Saurabh Sinha; Xiaoqing Xu; Alberto García-Ortiz; Sung Kyu Lim (IEEE Trans. Very Large Scale Integr. Syst., 2021)

3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal Tradeoffs. - Lingjun Zhu; Nesara Eranna Bethur; Yi-Chen Lu; Youngsang Cho; Yunhyeok Im; Sung Kyu Lim (ISLPED, 2022)

Buffer-based End-to-end Request Event Monitoring in the Cloud. - Kaihui Gao; Chen Sun 005; Shuai Wang 028; Dan Li 001; Yu Zhou 008; Hongqiang Harry Liu; Lingjun Zhu; Ming Zhang 005 (NSDI, 2022)

From luna to solar: the evolutions of the compute-to-storage networks in Alibaba cloud. - Rui Miao 001; Lingjun Zhu; Shu Ma; Kun Qian; Shujun Zhuang; Bo Li 061; Shuguang Cheng; Jiaqi Gao; Yan Zhuang; Pengcheng Zhang; Rong Liu; Chao Shi; et al. (SIGCOMM, 2022)

Design Automation and Test Solutions for Monolithic 3D ICs. - Lingjun Zhu; Arjun Chaudhuri; Sanmitra Banerjee; Gauthaman Murali; Pruek Vanna-Iampikul; Krishnendu Chakrabarty; Sung Kyu Lim (ACM J. Emerg. Technol. Comput. Syst., 2022)

A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs. - Yi-Chen Lu; Sai Pentapati; Lingjun Zhu; Gauthaman Murali; Kambiz Samadi; Sung Kyu Lim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022)

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. - Pruek Vanna-Iampikul; Lingjun Zhu; Serhat Erdogan; Mohanalingam Kathaperumal; Ravi Agarwal; Ram Gupta; Kevin Rinebold; Sung Kyu Lim (DAC, 2023)

INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps. - Lingjun Zhu; Sung Kyu Lim (DAC, 2023)

SmartDS: Middle-Tier-centric SmartNIC Enabling Application-aware Message Split for Disaggregated Block Storage. - Jie Zhang 081; Hongjing Huang; Lingjun Zhu; Shu Ma; Dazhong Rong; Yijun Hou; Mo Sun 001; Chaojie Gu; Peng Cheng 001; Chao Shi; Zeke Wang (ISCA, 2023)

A Comparative Study on Front-Side, Buried and Back-Side Power Rail Topologies in 3nm Technology Node. - Sandra Maria Shaji; Lingjun Zhu; Jun-Sik Yoon; Sung Kyu Lim (ISLPED, 2023)

Deploying User-space TCP at Cloud Scale with LUNA. - Lingjun Zhu; Yifan Shen; Erci Xu; Bo Shi; Ting Fu; Shu Ma; Shuguang Chen; Zhongyu Wang; Haonan Wu; Xingyu Liao; Zhendan Yang; Zhongqing Chen; et al. (USENIX ATC, 2023)

What are the actual needs of visually impaired people? - Menghan Hu; Qingyi Zhu; Lingjun Zhu (Displays, 2023)

Buffer-Based High-Coverage and Low-Overhead Request Event Monitoring in the Cloud. - Kaihui Gao; Chen Sun 005; Shuai Wang 028; Dan Li 001; Yu Zhou 008; Hongqiang Harry Liu; Lingjun Zhu; Ming Zhang 005; Xiang Deng; Cheng Zhou; Lu Lu 016 (IEEE/ACM Trans. Netw., 2023)

On Continuing DNN Accelerator Architecture Scaling Using Tightly Coupled Compute-on-Memory 3-D ICs. - Gauthaman Murali; Aditya Iyer 001; Lingjun Zhu; Jianming Tong; Francisco Muñoz-Martínez; Srivatsa Rangachar Srinivasa; Tanay Karnik; Tushar Krishna; Sung Kyu Lim (IEEE Trans. Very Large Scale Integr. Syst., 2023)

GNN-assisted Back-side Clock Routing Methodology for Advance Technologies. - Nesara Eranna Bethur; Pruek Vanna-Iampikul; Odysseas Zografos; Lingjun Zhu; Giuliano Sisto; Dragomir Milojevic; Alberto García Ortiz; Geert Hellings; Julien Ryckaert; Francky Catthoor; Sung Kyu Lim (DAC, 2024)

What's the Story in EBS Glory: Evolutions and Lessons in Building Cloud Block Store. - Weidong Zhang 011; Erci Xu; Qiuping Wang; Xiaolu Zhang; Yuesheng Gu; Zhenwei Lu; Tao Ouyang; Guanqun Dai; Wenwen Peng; Zhe Xu; Shuo Zhang; Dong Wu; et al. (FAST, 2024)

Demystifying Datapath Accelerator Enhanced Off-path SmartNIC. - Xuzheng Chen; Jie Zhang 081; Ting Fu; Yifan Shen; Shu Ma; Kun Qian; Lingjun Zhu; Chao Shi; Yin Zhang; Ming Liu 027; Zeke Wang (ICNP, 2024)

Hetero-3D: Maximizing Performance and Power Delivery Benefits of Heterogeneous 3D ICs. - Lingjun Zhu; Jiawei Hu; Gauthaman Murali; Sung Kyu Lim (ISLPED, 2024)

A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping. - Jinwoo Kim; Lingjun Zhu; Hakki Mert Torun; Madhavan Swaminathan; Sung Kyu Lim (IEEE Trans. Very Large Scale Integr. Syst., 2024)

Hey Hey, My My, Skewness Is Here to Stay: Challenges and Opportunities in Cloud Block Store Traffic. - Haonan Wu; Erci Xu; Ligang Wang; Yuandong Hong; Changsheng Niu; Bo Shi; Lingjun Zhu; Jinnian He; Dong Wu; Weidong Zhang 011; Qiuping Wang; Changhong Wang; et al. (EuroSys, 2025)

FlexiNS: A SmartNIC-Centric, Line-Rate and Flexible Network Stack. - Xuzheng Chen; Jie Zhang 081; Baolin Zhu; Xueying Zhu; Zhongqing Chen; Shu Ma; Lingjun Zhu; Chao Shi; Yin Zhang; Zeke Wang (CoRR, 2025)

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. - Pruek Vanna-Iampikul; Seungmin Woo; Serhat Erdogan; Lingjun Zhu; Mohanalingam Kathaperumal; Ravi Agarwal; Ram Gupta; Kevin Rinebold; Madhavan Swaminathan; Sung Kyu Lim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2025)

Evolving the Cloud Block Store with Performance, Elasticity, Availability, and Hardware Offloading. - Erci Xu; Weidong Zhang 011; Qiuping Wang; Xiaolu Zhang; Yuesheng Gu; Zhenwei Lu; Tao Ouyang; Guanqun Dong; Wenwen Peng; Zhe Xu; Shuo Zhang; Dong Wu; et al. (ACM Trans. Storage, 2025)