Investigation of the improvement of signal integrity in electrical circuits with degraded contacts using differential transmission. - Ziren Wang; Jinchun Gao; George T. Flowers; Lingyu Bi; Gang Xie 002; Yilin Zhou (IET Circuits Devices Syst., 2019)

Impact of ground solder ball failure in BGA package on near electric field radiation. - Yidong Yuan; Tianmeng Zhang; Ziren Wang; Kaixuan Song; Lingyu Bi; Lu Tian; Jinchun Gao (IEICE Electron. Express, 2022)