Survey of Chiplet Technology: SoC Architecture, Interconnect, EDA, and Advanced Packaging. - Hongwei Liu; Yuan Du; Bo Pu; Guojun Yuan; Yuhang Liu 001; Linji Zheng; Pengchao Wang; An Yang; Yu Li; Chengming Yu; Fei Guo; Xiaoteng Zhao; et al. (IEEE J. Emerg. Sel. Topics Circuits Syst., 2025)