Material and device innovation impact on reliability for scaled CMOS technologies. - Tanya Nigam; Andreas Kerber; Tian Shen; Rakesh Ranjan; Linjun Cao (ESSDERC, 2017)

Effect of metal line width on electromigration of BEOL Cu interconnects. - Seungman Choi; Cathryn Christiansen; Linjun Cao; James Zhang; Ronald Filippi; Tian Shen; Kong Boon Yeap; Sean P. Ogden; Haojun Zhang; Bianzhu Fu; Patrick Justison (IRPS, 2018)