Evaluation of Thermal and Power integrity and its Impact on Performance for 3D Memory-on-Logic CPUs with FSPDN and BSPDN. - Yumeng Wang; Xincheng Liu; Hu Zhou; Linqiu Wang; Haolan Yang; Zhuojun Chen; Zhiyong Zhang; Lianmao Peng; Rongmei Chen (DATE, 2026)

Architecture, Design and Technology Co-optimization for 3D ICs with Advanced BSPDN Considering Power & Thermal Integrity Impact. - Hu Zhou; Haolan Yang; Xingcheng Liu; Linqiu Wang; Feifan Xie; Yumeng Wang; Zhuojun Chen; Zhiyong Zhang; Lianmao Peng; Rongmei Chen (DATE, 2026)