BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond. - Gaurav Thareja; Ashish Pal; Xingye Wang; Sefa Dag; Shi You; Shashank Sharma; Qing Zhu; Carmen L. Cervantes; Shinjae Hwang; Matthew Spuller; Ben Ng; Pradeep S. Kumar; et al. (VLSI Technology and Circuits, 2023)