Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure. - Yuling Shang; Liyuan Sun 003; Chunquan Li 004; Jianfeng Ma (J. Electron. Test., 2017)

TSV Manufacturing Fault Modeling and Diagnosis Based on Multi-Tone Dither. - Yuling Shang; Min Tan; Chunquan Li 004; Liyuan Sun 003 (J. Adv. Comput. Intell. Intell. Informatics, 2019)