Operand Isolation with Reduced Overhead for Low Power Datapath Design. - Lokesh Siddhu; Amit Mishra 002; Virendra Singh (VLSID, 2014)

FastCool: Leakage Aware Dynamic Thermal Management of 3D Memories. - Lokesh Siddhu; Preeti Ranjan Panda (DATE, 2019)

PredictNcool: Leakage Aware Thermal Management for 3D Memories Using a Lightweight Temperature Predictor. - Lokesh Siddhu; Preeti Ranjan Panda (ACM Trans. Embed. Comput. Syst., 2019)

Leakage-Aware Dynamic Thermal Management of 3D Memories. - Lokesh Siddhu; Rajesh Kedia; Preeti Ranjan Panda (ACM Trans. Design Autom. Electr. Syst., 2021)

CoreMemDTM: Integrated Processor Core and 3D Memory Dynamic Thermal Management for Improved Performance. - Lokesh Siddhu; Rajesh Kedia; Preeti Ranjan Panda (DATE, 2022)

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems. - Lokesh Siddhu; Rajesh Kedia; Shailja Pandey; Martin Rapp; Anuj Pathania; Jörg Henkel; Preeti Ranjan Panda (ACM Trans. Archit. Code Optim., 2022)

Special Session - Non-Volatile Memories: Challenges and Opportunities for Embedded System Architectures with Focus on Machine Learning Applications. - Jörg Henkel; Lokesh Siddhu; Lars Bauer; Jürgen Teich; Stefan Wildermann; Mehdi B. Tahoori; Mahta Mayahinia; Jerónimo Castrillón; Asif Ali Khan; Hamid Farzaneh; João Paulo C. de Lima; Jian-Jia Chen; et al. (CASES, 2023)

Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure. - Lokesh Siddhu; Aritra Bagchi; Rajesh Kedia; Isaar Ahmad; Shailja Pandey; Preeti Ranjan Panda (ACM Trans. Embed. Comput. Syst., 2023)

Swift-CNN: Leveraging PCM Memory's Fast Write Mode to Accelerate CNNs. - Lokesh Siddhu; Hassan Nassar; Lars Bauer; Christian Hakert; Nils Hölscher; Jian-Jia Chen; Jörg Henkel (IEEE Embed. Syst. Lett., 2023)

Co-Designing NVM-based Systems for Machine Learning and In-memory Search Applications. - Jörg Henkel; Lokesh Siddhu; Hassan Nassar; Lars Bauer; Jian-Jia Chen; Christian Hakert; Tristan Taylan Seidl; Kuan-Hsun Chen; Xiaobo Sharon Hu; Mengyuan Li; Chia-Lin Yang; Ming-Liang Wei (ICCAD, 2024)

An FPGA-Based RISC-V Instruction Set Extension and Memory Controller for Multi-Level Cell NVM. - Mina Ibrahim; Martel Shokry; Lokesh Siddhu; Lars Bauer; Hassan Nassar; Jörg Henkel (ICM, 2024)

NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching. - Shailja Pandey; Lokesh Siddhu; Preeti Ranjan Panda (ACM Trans. Design Autom. Electr. Syst., 2024)

ML-Based Thermal and Cache Contention Alleviation on Clustered Manycores With 3-D HBM. - Mohammed Bakr Sikal; Heba Khdr; Lokesh Siddhu; Jörg Henkel (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2024)

Modeling and Simulating Emerging Memory Technologies: A Tutorial. - Yun-Chih Chen; Tristan Taylan Seidl; Nils Hölscher; Christian Hakert; Minh Duy Truong; Jian-Jia Chen; João Paulo C. de Lima; Asif Ali Khan; Jerónimo Castrillón; Ali Nezhadi; Lokesh Siddhu; Hassan Nassar; et al. (CoRR, 2025)