Mapping the failure envelope of board-level solder joints. - Long Bin Tan; Xiaowu Zhang; Chwee Teck Lim; Vincent B. C. Tan (Microelectron. Reliab., 2009)

Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. - Y. A. Su; Long Bin Tan; T. Y. Tee; Vincent B. C. Tan (Microelectron. Reliab., 2010)

Effect of helmet liner systems and impact directions on severity of head injuries sustained in ballistic impacts: a finite element (FE) study. - Kwong Ming Tse; Long Bin Tan; Bin Yang; Vincent Beng Chye Tan; Heow Pueh Lee (Medical Biol. Eng. Comput., 2017)

Noise Attenuation by Sonic Crystal Window. - Hsiao Mun Lee; Wensheng Luo; Long Bin Tan; Kian Meng Lim; Jinlong Xie; Heow Pueh Lee (iSCI, 2019)