A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature. - Jiaxing Hu; Bo Jing; Yifeng Huang; Xiaoxuan Jiao; Meng Sun; Longteng Li (IEEE Access, 2020)

Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes. - Longteng Li; Bo Jing; Jiaxing Hu; Xiaoxuan Jiao; Jinxin Pan; Hongda Sun 003 (IEEE Access, 2020)

SiSL-Net: Saliency-guided self-supervised learning network for image classification. - Kun Liu 009; Rui Meng; Longteng Li; Jingkun Mao; Haiyong Chen (Neurocomputing, 2022)