Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules. - Daniel T. Rooney; Louis Gullo; Dongji Xie; N. Todd Castello; Dongkai Shanguan (Microelectron. Reliab., 2007)

Applying Software Reliability Growth Models to DOD Systems. - E. Andrew Long; Louis Gullo; Allen P. Nikora (ISSRE Workshops, 2012)