Front-side mid-level Tungsten TSV integration for high-density 3D applications. - Brian Mattis; Lovelace Soirez; Catherine Bullock; Dave Martini; Sara Jensen; James Levy; Adam Jones (3DIC, 2016)

Copper Damascene Based Heterogeneous Integration of GaN with CMOS on 200 mm Si Substrates (Invited). - Jeffrey LaRoche; Lovelace Soirez; Eduardo Chumbes (IRPS, 2025)