Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. - Thomas Frank; Stéphane Moreau; Cédrick Chappaz; Patrick Leduc; Lucile Arnaud; Aurélie Thuaire; Emmanuel Chery; F. Lorut; Lorena Anghel; Gilles Poupon (Microelectron. Reliab., 2013)

Study of EM void nucleation and mechanic relaxation effects. - Giulio Marti; Lucile Arnaud; Yves Wouters (Microelectron. Reliab., 2014)

Interconnect design study for electromigration reliability improvement. - Giulio Marti; Lucile Arnaud; David Ney; Yves Wouters (IRPS, 2015)

Towards high density 3D interconnections. - Séverine Cheramy; Amadine Jouve; Lucile Arnaud; Claire Fenouillet-Béranger; Perrine Batude; Maud Vinet (3DIC, 2016)

ITAC: A complete 3D integration test platform. - Didier Lattard; Lucile Arnaud; Arnaud Garnier; Nicolas Bresson; Franck Bana; R. Segaud; Amadine Jouve; H. Jacquinot; Stéphane Moreau; Karim Azizi-Mourier; C. Chantre; Pascal Vivet; et al. (3DIC, 2016)

BISTs for post-bond test and electrical analysis of high density 3D interconnect defects. - Imed Jani; Didier Lattard; Pascal Vivet; Lucile Arnaud; Edith Beigné (ETS, 2018)

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. - Lucile Arnaud; Stéphane Moreau; Amadine Jouve; Imed Jani; Didier Lattard; F. Fournel; C. Euvrard; Y. Exbrayat; Viorel Balan; Nicolas Bresson; S. Lhostis; J. Jourdon; et al. (IRPS, 2018)

Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects. - Imed Jani; Didier Lattard; Pascal Vivet; Lucile Arnaud; Edith Beigné (3DIC, 2019)

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. - Pascal Vivet; Eric Guthmuller; Yvain Thonnart; Gaël Pillonnet; Guillaume Moritz; Ivan Miro-Panades; César Fuguet Tortolero; Jean Durupt; Christian Bernard; Didier Varreau; Julian J. H. Pontes; Sébastien Thuries; et al. (ISSCC, 2020)

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. - Christophe Dubarry; Lucile Arnaud; Maria-Luisa Calvo-Muñoz; Gaëlle Mauguen; Stéphane Moreau; R. Crochemore; Nicolas Bresson; Bernard Aventurier (3DIC, 2021)

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. - Pascal Vivet; Eric Guthmuller; Yvain Thonnart; Gaël Pillonnet; César Fuguet Tortolero; Ivan Miro-Panades; Guillaume Moritz; Jean Durupt; Christian Bernard; Didier Varreau; Julian J. H. Pontes; Sébastien Thuries; et al. (IEEE J. Solid State Circuits, 2021)

Apocalypse Dog. - Aziliz Le Clainche; Camille Nasarre; Jing Qian; Juliette Barraux; Emma Plumey; Lucile Arnaud; Solène Cauchie; Philippe Meis (SIGGRAPH Asia Computer Animation Festival, 2022)