Plasma modification of polymer surfaces for adhesion improvement. - Frank D. Egitto; Luis J. Matienzo (IBM J. Res. Dev., 1994)

Effects of mechanical stress and moisture on packaging interfaces. - Stephen L. Buchwalter; Peter J. Brofman; Claudius Feger; Michael A. Gaynes; Kang-Wook Lee 003; Luis J. Matienzo; David L. Questad (IBM J. Res. Dev., 2005)