Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. - Luka Kljucar; Mario Gonzalez; Ingrid De Wolf; Kristof Croes; Jürgen Bömmels; Zsolt Tökei (Microelectron. Reliab., 2016)

Study of GHz-SAM sensitivity to delamination in BEOL layers. - Ahmad Khaled; Luka Kljucar; Sebastian Brand 001; Michael Kögel; Robert Aertgeerts; Ruben Nicasy; Ingrid De Wolf (Microelectron. Reliab., 2017)

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. - Luka Kljucar; Mario Gonzalez; Kristof Croes; Ingrid De Wolf; Joke De Messemaeker; Gayle Murdoch; Philip Nolmans; Joeri De Vos; Jürgen Bömmels; Eric Beyne; Zsolt Tökei (Microelectron. Reliab., 2017)

Stress mitigation of 3D-stacking/packaging induced stresses. - Kristof Croes; Vladimir Cherman; Melina Lofrano; Houman Zahedmanesh; Luka Kljucar; Mario Gonzalez; Ingrid De Wolf; Zsolt Tökei; Eric Beyne (IRPS, 2018)