Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes. - Luke England; Siew Tze Eng; Chris Liew; Hock Heng Lim (Microelectron. Reliab., 2011)

Impact of TSV integration on 14nm FinFET device performance. - Luke England; Sukeshwar Kannan; Rahul Agarwal; Daniel Smith (3DIC, 2016)

Power delivery in 3D packages: current crowding effects, dynamic IR drop and compensation network using sensors (invited paper). - Sukeshwar Kannan; Mehdi Sadi; Luke England (ICCAD, 2016)

Design of a digital IP for 3D-IC die-to-die clock synchronization. - Mehdi Sadi; Sukeshwar Kannan; Luke England; Mark Tehranipoor (ISCAS, 2017)

Compact Scalable Dynamic TSV IR Drop Compensation for Power Delivery in 3D Packages. - Arjun Chaudhuri; Sukeshwar Kannan; Luke England; Jack Golz (MWSCAS, 2019)