Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization. - Irina Bauer; Kirsten Weide-Zaage; Lutz Meinshausen (Microelectron. Reliab., 2011)

Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. - Lutz Meinshausen; Kirsten Weide-Zaage; Hélène Frémont (Microelectron. Reliab., 2011)

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage (Microelectron. Reliab., 2012)

Electro- and thermo-migration induced failure mechanisms in Package on Package. - Lutz Meinshausen; Kirsten Weide-Zaage; Hélène Frémont (Microelectron. Reliab., 2012)

Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage; Bernard Plano (Microelectron. Reliab., 2013)

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. - Aymen Moujbani; Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein; Lutz Meinshausen (Microelectron. Reliab., 2013)

Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage; Bernard Plano (Microelectron. Reliab., 2015)

Dynamical IMC-growth calculation. - Lutz Meinshausen; Kirsten Weide-Zaage; Hélène Frémont (Microelectron. Reliab., 2015)

Evolution and Optimization of BEOL MOM Capacitors Across Advanced CMOS Nodes. - Jinglin Shi; A. Sidelnicov; Kok Wai J. Chew; Mei See Chin; C. Schippel; J. M. M. dos Santos; Frank Schlaphof; Lutz Meinshausen; John R. Long; David L. Harame (ESSDERC, 2018)

BEoL Reliability, XPS and REELS Study on low-k Dielectrics to understand Breakdown Mechanisms. - Betting Wehring; Raik Hoffmann; Lukas Gerlich; Malte Czernohorsky; Benjamin Uhlig; Robert Seidel; Tobias Barchewitz; Frank Schlaphof; Lutz Meinshausen; Christoph Leyens (IRPS, 2020)