Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages. - Li Zhang; Vivek Arora; Luu Nguyen; Nikhil Kelkar (Microelectron. Reliab., 2004)

TCAD modeling of encapsulation layer in high-voltage, high-temperature operation regime. - Ilaria Imperiale; Susanna Reggiani; Elena Gnani; Antonio Gnudi; Giorgio Baccarani; Luu Nguyen; Marie Denison (ESSDERC, 2014)

ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments. - Pradeep Lall; Shantanu Deshpande; Luu Nguyen (ICPHM, 2016)

Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization. - Andres Garcia; Nathan Warner; Nandika Anne D'Souza; Enis Tuncer; Luu Nguyen; Marie Denison; Jeffrey T. Fong (IEEE Trans. Ind. Electron., 2016)

Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture. - Davide Cornigli; Susanna Reggiani; Antonio Gnudi; Elena Gnani; Giorgio Baccarani; Davide Fabiani; Dhanoop Varghese; Enis Tuncer; S. Krishnan; Luu Nguyen (Microelectron. Reliab., 2018)