Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. - Sylvain Joblot; Alexis Farcy; Nicolas Hotellier; Amadine Jouve; François de Crecy; Arnaud Garnier; M. Argoud; C. Ferrandon; J.-P. Colonna; R. Franiatte; C. Laviron; Séverine Cheramy (3DIC, 2013)

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. - Amadine Jouve; Y. Sinquin; Arnaud Garnier; M. Daval; Pascal Chausse; M. Argoud; N. Allouti; Laurence Baud; Jérôme Dechamp; R. Franiatte; Séverine Cheramy; H. Kato; et al. (3DIC, 2015)