Improved physical understanding of intermittent failure in continuous monitoring method. - W. C. Maia Filho; M. Brizoux; Hélène Frémont; Yves Danto (Microelectron. Reliab., 2006)

Torsion test applied for reballing and solder paste volume evaluation. - W. C. Maia Filho; M. Brizoux; Hélène Frémont; Yves Danto (Microelectron. Reliab., 2007)

Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy. - B. Dompierre; W. C. Maia Filho; M. Brizoux; Véronique Aubin; Eric Charkaluk (Microelectron. Reliab., 2010)

Thermo-mechanical simulation of PCB with embedded components. - Wiyao Kpobie; Marion Martiny; Sebastien Mercier; François Lechleiter; Laurent Bodin; Aurélien Lecavelier des Etangs-Levallois; M. Brizoux (Microelectron. Reliab., 2016)