A location-based incentive pricing scheme for tree-based relaying in multi-hop cellular networks. - M. H. Lin; C. C. Lo (Integrated Network Management, 2005)

Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. - M. H. Lin; Y. L. Lin; K. P. Chang; K. C. Su; Tahui Wang (Microelectron. Reliab., 2005)

Effects of width scaling and layout variation on dual damascene copper interconnect electromigration. - M. H. Lin; K. P. Chang; K. C. Su; Tahui Wang (Microelectron. Reliab., 2007)

Effects of length scaling on electromigration in dual-damascene copper interconnects. - M. H. Lin; M. T. Lin; Tahui Wang (Microelectron. Reliab., 2008)

Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k dual damascene interconnects. - M. H. Lin; A. S. Oates (IRPS, 2015)

Redundancy Effect on Electromigration Failure Time in Power Grid Networks. - M. H. Lin; C. I. Lin; Y. C. Wang; Aaron Wang (IRPS, 2022)

A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects. - Y. H. Lin; Chang-Chun Lee; C. Y. Liao; M. H. Lin; W. C. Tu; Robin Chen; H. P. Chen; Winston S. Shue; Min Cao (IRPS, 2023)