Test structure assembly for bump bond yield measurement on high density flip chip technologies. - Miguel Ullán; Manuel Lozano 003; Mokhtar Chmeissani; G. Blanchot; Enric Cabruja; J. García; M. Maiorino; Ricardo Martínez; Giulio Pellegrini; Carles Puigdengoles (Microelectron. Reliab., 2006)